Delivery terms
Product will be ordered from supplier. If the supplier is unable to deliver by the specified date, we will inform you by e-mail
Not available | Supplier Warehouse |
Home delivery in Lithuania
After handing over the goods to the courier, we will inform you by e-mail. If you are ordering outside of Lithuania please use www.lemona-electronics.eu to order.
Over €50.00 (Orders up to 1000 kgs) | For free |
To €50.00 (Orders up to 3 kgs) | €3.49 |
To €50.00 (Orders up to 1000 kgs) | €4.99 |
Delivery to a DPD Pickup location
After handing over the goods to the courier, we will inform you by e-mail. Orders over €50.00 are delivered free of charge.
€2.39
Product description
Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Useful information
Specifications
SKU
U-2467189
Product code
374224B60023G
Supplier product description
Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Useful information
Supplier parameters
Product code
374224B60023G
Product ID
U-2467189
Application
BGA
Colour
black
Heatsink shape
grilled
Height
25mm
Length
23mm
Manufacturer
BOYD CORP
Material
aluminium
Material finishing
anodized
Type of heatsink
extruded
Width
23mm
Supplier's product code
374224B60023G
The information that supplier provides may differ from the actual product. If you noticed an error please let us know by email: [email protected].