Delivery terms
Product will be ordered from supplier. If the supplier is unable to deliver by the specified date, we will inform you by e-mail
Supplier Warehouse |
Home delivery in Lithuania
After handing over the goods to the courier, we will inform you by e-mail. If you are ordering outside of Lithuania please use www.lemona-electronics.eu to order.
Over €30.00 (Orders up to 1000 kgs) | For free |
To €30.00 (Orders up to 3 kgs) | €2.99 |
To €30.00 (Orders up to 1000 kgs) | €3.59 |
Delivery to a DPD Pickup location
After handing over the goods to the courier, we will inform you by e-mail. Orders over €30.00 are delivered free of charge.
€1.99
Product description
Heatsink: extruded; grilled; BGA,FPGA; black; L: 11.1mm; W: 10.2mm BOYD CORP
Useful information
Specifications
SKU
U-2467208
Product code
375224B00032G
Supplier product description
Heatsink: extruded; grilled; BGA,FPGA; black; L: 11.1mm; W: 10.2mm
Useful information
Supplier parameters
Supplier's product code
375224B00032G
Product ID
U-2467208
Product code
375224B00032G
Application
BGA
Colour
black
Heatsink shape
grilled
Height
10.2mm
Length
11.1mm
Manufacturer
BOYD CORP
Material
aluminium
Material finishing
anodized
Type of heatsink
extruded
Width
10.2mm
The information that supplier provides may differ from the actual product. If you noticed an error please let us know by email: [email protected].